Soft waffle pad with open-cell foam that prevents overheating. Ideal for final polishing, hologram and swirl removal and achieving a high gloss. 

Dimensions:
- 100mm x 25mm
- 145mm x 25mm

• prevents heat build-up during polishing 
• non-accumulative texture ensures a clean, high-gloss finish
• soft and springy texture is ideal for finishing touches
• best used with compound 3290 P90 Fine-Cut