Soft waffle pad with open-cell foam that prevents overheating. Ideal for final polishing, hologram and swirl removal and achieving a high gloss. - prevents heat build-up during polishing - non-accumulative texture ensures a clean, high-gloss finish. - soft and springy texture is ideal for finishing touches. - best used with compound 3290 P90 Fine-Cut Dimensions: - 80mm/100mm/25mm - 125mm/145mm/25mm